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Key Features

  1. 4th Gen Intel? Xeon? Scalable processors, Dual Socket LGA-4677 (Socket E) , CPU TDP supports up to 350W TDP

  2. Support CXL

  3. Intel? C741 Chipset

  4. Up to 4TB 3DS ECC RDIMM, DDR5-4800MT/s(1DPC) in 16 DIMM slots

  5. Broadcom BCM57416 Dual ports 10G LAN

  6. 2 SATA DOM ports

  7. 2 M.2

  8. 4 NVMe ports PCIe 5.0 x4 via 2 MCIO connectors

  9. 5 PCIe 5.0 x16

  10. 1 PCIe 5.0 x8

  11. 8 SATA 3.0 ports(C741, RAID 0, 1, 5, 10)

  12. HD Audio 7.1 channel

  13. 1 USB 3.1 Gen 2, 6 USB 3.0

Product SKUs
MBD-X13DAI-T
Physical Stats
Form Factor
  • EATX

Dimension
  • 12.1" x 13.1" (30.734cm x 33.274cm)

Processor
CPU
Core
  • Up to 60 cores

System Memory
Memory Capacity
  • 16 DIMM slots

  • Up to 4TB 3DS ECC RDIMM, DDR5-4800MHz

Memory Type
  • 4800/4400/4000 MT/s ECC DDR5 RDIMM (3DS) 256GB 4800MT/s

DIMM Sizes
  • 16GB, 32GB, 64GB, 128GB, 256GB

  • RDIMM: 16GB, 32GB, 64GB, 128GB, 256GB

Memory Voltage
  • 1.1V

Error Detection
  • Detects double-bit errors (using ECC memory)

On-Board Devices
Chipset
  • Intel? C741

SATA
  • 8 SATA3 ports; RAID 0, 1, 5, 10

  • 2 SATA3 ports; RAID 0,1

Audio
  • Realtek ALC888S

Network Controllers
  • Dual LAN with Broadcom BCM57416 10GBase-T

Input / Output
SATA
  • 8 SATA3 (6Gbps) port(s)

  • 2 SATA3 (6Gbps) port(s)

USB
  • 2 USB 2.0 port(s) (2 via header)

  • 6 USB 3.0 port(s) (4 rear type A; 2 via header)

  • 1 USB 3.1 Gen2 port(s) (1 via header)

Video Output
  • 1 VGA D-Sub Connector port(s)

TPM
  • TPM Chip

Others
  • 2 MCIO PCIe 5.0 x8

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