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Key Features


    • 3rd Gen Intel? Xeon? Scalable processors

    • Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s

  1. Intel? C621A


    • Up to 8TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 8TB 3DS ECC LRDIMM, DDR4-3200MHz

    • Up to 8GB Unbufferred ECC Intel? Optane? Persistent Memory 200 Series, DDR4-3200MHz, in 32 DIMM slots


    • 16 PCIe 4.0 x8

    • M.2 Interface: 2 PCIe 4.0 x4

    • M.2 Form Factor: 2280/22110

    • 1 PCIe 4.0 x16

  2. Networking options provided via Ultra RiserDual LAN with 1GbE LAN via Intel? i350-AM2

  3. 1 VGA port

Product SKUs
MBD-X12DPG-OA6
Physical Stats
Form Factor
  • Proprietary

Dimension
  • 15" x 17" (38.1cm x 43.18cm)

Processor
CPU
  • 3rd Gen Intel? Xeon? Scalable processors

  • Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s

Core
  • Up to 40 cores

System Memory
Memory Capacity
  • 32 DIMM slots

  • Up to 8GB Unbuffered Intel? Optane? Persistent Memory 200 Series, DDR4-3200MHz

  • Up to 8TB 3DS ECC LRDIMM, DDR4-3200MHz; Up to 8TB 3DS ECC RDIMM, DDR4-3200MHz

Memory Type
  • ECC DDR4 LRDIMM (3DS), RDIMM (3DS)

DIMM Sizes
  • N/A

Memory Voltage
  • 1.2V

On-Board Devices
Chipset
  • Intel? C621A

IPMI
  • ASPEED AST2600 BMC

Network Controllers
  • Dual LAN with 1GbE LAN via Intel? i350-AM2

Input / Output
SATA
  • 8 SATA3 (6Gbps) port(s)

USB
  • 5 USB 3.2 Gen2 port(s) (2 via header; 2 rear; 1 type A)

Video Output
  • 1 VGA port(s)

Serial Port 0
0

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