超微主板 X13SEW-F 支持第四代至强可扩展 LGA4667

Key Features

1. 4th Gen Intel? Xeon? Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP

2. Intel C741? Chipset

3. Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots

4. 
   

• 1 PCIe 5.0 x8 ( in x16)

• 1 PCIe 5.0 x32

• M.2 Interface: 1 PCIe 3.0 x2

• M.2 Form Factor: 2280, 22110

• M.2 Key: M-Key

5. 10 NVMe ports PCIe 5.0 x8 via 5 MCIO connectors

6. Dual LAN with 1GbE with Intel? I210

7. 2 SuperDOM with built-in power

8. I/O: 1 VGA, 2 COM, 1 TPM header

9. 4 USB 3.2 Gen1 (2 rear, 2 via header), 3 USB 2.0 (2 rear, 1 via Type-A)

10. Intel? C741 controller for 10 SATA3 (6 Gbps) ports