超微主板 H13SST-G 支持 AMD SP3 CPU

超微主板 H13SST-G 支持 AMD SP3 CPU

Key Features

AMD EPYC 9004 series Processors
System on Chip
Up to 3TB 3DS ECC RDIMM, DDR5-4800MHz in 12 DIMM slots
AMD FCH controller for 8 SATA3 (6 Gbps) ports;
1x PCIe 4.0 x8 4C connector (for front I/O module), 5x PCIe 5.0 x8 MCIO connectors
M.2 Interface: 2 SATA/PCIe 4.0 x4, M.2 Form Factor: 2280

Product SKUs
MBD-H13SST-G

Physical Stats
Form Factor	Proprietary GrandTwin
Dimension	8.53" x 12.42" (21.67cm x 31.55cm)

Processor
CPU	AMD EPYC 9004 series Processors Single Socket SP5 supported, CPU TDP supports Up to 400W TDP
Core	Up to 96/192

System Memory
Memory Capacity	12 DIMM slots Up to 3TB 3DS ECC Registered RDIMM, DDR5-4800MHz
Memory Type	4800 MT/s ECC DDR5 RDIMM (3DS) Up to 256GB of memory with speeds of up to 4800MHz (1DPC)
DIMM Sizes	16GB, 24GB, 32GB, 40GB, 48GB, 64GB, 80GB, 96GB, 128GB, 192GB, 256GB
Memory Voltage	1.1V
Error Detection	Corrects single-bit errors Detects double-bit errors (using ECC memory)

On-Board Devices
Chipset	System on Chip
IPMI	ASPEED AST2600 BMC
Graphics	1 Aspeed AST2600 BMC port(s)
Network Controllers	N/A

Input / Output
TPM	1 TPM header
Others	4 MCIO (PCIe 5.0 x8) Port(s) 1 MCIO (PCIe 5.0 x8/SATA3) Port(s)

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