图片关键词

Key Features

  1. 3rd Gen Intel? Xeon? Scalable processors
    Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s

  2. Intel? C621A

  3. Up to 8TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 8TB 3DS ECC LRDIMM, DDR4-3200MHz
    Up to 8GB Unbufferred ECC Intel? Optane? Persistent Memory 200 Series, DDR4-3200MHz, in 32 DIMM slots

  4. 3 PCI-E 4.0 x16
    M.2 Interface: 2 PCI-E 4.0 x4
    M.2 Form Factor: 2280/22110

  5. Intel? C621A controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10

  6. 1 VGA port

Product SKUs

MBD-X12DGO-6
  • X12DGO-6



Physical Stats

Form Factor
  • Proprietary

Dimension
  • 15.09" x 16.85" (38.33cm x 42.8cm)



Processor

CPU
  • 3rd Gen Intel? Xeon? Scalable processors

  • Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s

Core
  • Up to 40 cores



System Memory

Memory Capacity
  • 32 DIMM slots

  • Up to 8TB Intel? Optane? Persistent Memory 200 Series, DDR4-3200MHz

  • Up to 8TB 3DS ECC LRDIMM, DDR4-3200MHz; Up to 8TB 3DS ECC RDIMM, DDR4-3200MHz

Memory Type
  • ECC DDR4 LRDIMM (3DS), RDIMM (3DS)

DIMM Sizes
  • LRDIMM: 16GB, 32GB, 64GB, 128GB, 256GB

  • RDIMM: 16GB, 32GB, 64GB, 128GB, 256GB

Memory Voltage
  • 1.2V



On-Board Devices

Chipset
  • Intel? C621A

SATA
  • Intel? C621A controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10

IPMI
  • ASPEED AST2600 BMC

Network Controllers
  • N/A


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