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超微主板 X13DEI 支持第四代至强可扩展 LGA4677

超微主板 X13DEI 支持第四代至强可扩展 LGA4677

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Key Features

  1. 4th Gen Intel? Xeon? Scalable processors, Dual Socket LGA-4677 (Socket E) , CPU TDP supports up to 350W TDP

  2. Support CXL

  3. Intel? C741 Chipset

  4. Up to 4TB 3DS ECC RDIMM, DDR5-4800MT/s(1DPC) in 16 DIMM slots

  5. 4 PCIe 5.0 x16

  6. 2 PCIe 5.0 x8

  7. Broadcom BCM5720 Dual ports 1G LAN

  8. 6 USB3.0 and 3 USB2.0

  9. 2 SATA DOM ports

  10. 2 M.2

  11. 6 NVMe ports PCIe 5.0 x4 via 3 MCIO connectors

  12. 8 SATA3.0 ports

Product SKUs
MBD-X13DEI
Physical Stats
Form Factor

  • EATX

Dimension

  • 12.1" x 13.05" (30.74cm x 33.15cm)

Processor
CPU
Core

  • Up to 60 cores

System Memory
Memory Capacity

  • 16 DIMM slots

  • Up to 4TB 3DS ECC RDIMM, DDR5-4800MHz

Memory Type

  • 4800/4400/4000 MT/s ECC DDR5 RDIMM (3DS) Up to 256GB of memory with speeds of up to 4800MT/s (1DPC)

DIMM Sizes

  • 16GB, 32GB, 64GB, 128GB, 256GB

  • RDIMM: 16GB, 32GB, 64GB, 128GB, 256GB

Memory Voltage

  • 1.1V

Error Detection

  • Corrects single-bit errors

  • Detects double-bit errors (using ECC memory)

On-Board Devices
Chipset

  • Intel? C741

SATA

  • Intel? C741 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10

  • Intel? C741 controller for 2 SATA3 (6 Gbps) ports; RAID 0,1

IPMI

  • ASPEED AST2600 BMC

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