超微主板 X13SEM-TF 支持第四代至强 可扩展 LGA4677

Key Features

1. 4th Gen Intel? Xeon? Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP

2. Intel C741? Chipset

3. Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots

4. 8 NVMe ports PCIe 5.0 x4 via 4 MCIO connectors

5. 
   

• 1 PCIe 5.0 x8,

• 2 PCIe 5.0 x16,

• 4 PCIe 5.0 x8 MCIO connectors

• M.2 Interface: 2 PCIe 4.0 x2

• M.2 Form Factor: 2280, 22110

• M.2 Key: M-Key

6. Dual LAN with 10GBase-T with Intel? X550

7. 5 USB 3.2 Gen1 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)

8. Intel? C741 controller for 10 SATA3 (6 Gbps) ports or 2 PCIe 3.0 x4 NVMe + 2 SATA3 ports