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超微主板 H13SSF 支持AMD SP3 CPU

超微主板 H13SSF 支持AMD SP3 CPU

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Key Features

  1. AMD EPYC 9004 series Processors

  2. System on Chip

  3. Up to 6TB 3DS ECC RDIMM, DDR5-4800* MHz in 24 DIMM slots. *DDR5-4000MHz in 24 DIMM slots (1R, 2DPC) DDR5-3600MHz in 24 DIMM slots (2R, 2DPC)


    • 2 PCIe 5.0 x16 via Riser Slot

    • 8 PCIe 5.0 x8 via MCIO

    • 2 PCIe 5.0 x16 AIOM/ OCP3.0 Networking Slot

    • M.2 Interface: 1 PCIe 3.0 x4, 1 PCIe 3.0 x2

    • M.2 Form Factor: 2280/22110

  5. Integrated IPMI 2.0 + KVM with dedicated LAN via Rear IO

  6. ASPEED AST2600 BMC graphics

  7. 2 SATA3 via SlimSAS connector

  8. 2 USB 3.0 from Rear IO+ 2 USB3.0 via Header

Product SKUs
MBD-H13SSF
Physical Stats
Form Factor

  • Proprietary

Dimension

  • 17" x 13.63" (43.18cm x 34.62cm)

Processor
CPU

  • AMD EPYC 9004 series Processors

  • Single Socket SP5 supported, CPU TDP supports Up to 400W TDP

Core

  • Up to 96/192

System Memory
Memory Capacity

  • 24 DIMM slots

  • Up to 6TB 3DS ECC Registered RDIMM, DDR5-4800MHz

Memory Type

  • 4800 MT/s ECC DDR5 RDIMM (3DS) Up to 256GB of memory with speeds of up to 4000MHz (2DPC), up to 4800MHz (1DPC)

DIMM Sizes

  • 16GB, 24GB, 32GB, 40GB, 48GB, 64GB, 80GB, 96GB, 128GB, 192GB, 256GB

Memory Voltage

  • 1.1V

Error Detection

  • Corrects single-bit errors

  • Detects double-bit errors (using ECC memory)

On-Board Devices
Chipset

  • System on Chip

IPMI

  • ASPEED AST2600 BMC

Graphics

  • 1 Aspeed AST2600 BMC port(s)

Network Controllers

  • N/A

Input / Output
USB

  • 2 USB 3.0 port(s) (2 via header)

TPM

  • 1 TPM Header

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