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超微主板 H13DSH 支持AMD SP3 CPU

超微主板 H13DSH 支持AMD SP3 CPU

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Key Features

  1. AMD EPYC 9004 series Processors

  2. Up to 6TB 3DS ECC RDIMM, DDR5-4800MHz in 24 DIMM slots

  3. Integrated IPMI 2.0 + KVM with dedicated LAN

  4. 32x SATA3 Hybrid via MCIO, 1 AIOM slot

  5. ASPEED AST2600 BMC graphics via I/O board

  6. 10 PCIe 5.0 x8 MCIO connectors

  7. 4x USB 3.0 ports (2 rear via I/O board + 2 via header)

Product SKUs
MBD-H13DSH
Physical Stats
Form Factor

  • Proprietary

Dimension

  • 17" x 11.5" (43.18cm x 29.21cm)

Processor
CPU

  • AMD EPYC 9004 series Processors

  • Dual Socket SP5 supported, CPU TDP supports Up to 400W TDP

Core

  • Up to 192/384

System Memory
Memory Capacity

  • 24 DIMM slots

  • Up to 6TB 3DS ECC Registered RDIMM, DDR5-4800MHz

Memory Type

  • 4800 MT/s ECC DDR5 RDIMM (3DS) Up to 256GB of memory with speeds of up to 4800MHz (1DPC)

DIMM Sizes

  • 16GB, 24GB, 32GB, 40GB, 48GB, 64GB, 80GB, 96GB, 128GB, 192GB, 256GB

Memory Voltage

  • 1.1V

Error Detection

  • Corrects single-bit errors

  • Detects double-bit errors (using ECC memory)

On-Board Devices
Chipset

  • System on Chip

Graphics

  • 1 Aspeed AST2600 BMC port(s)

Network Controllers

  • N/A

Input / Output
LAN

  • 1 RJ45 Dedicated IPMI LAN port via I/O board

USB

  • 2 USB 3.0 port(s) (2 via header)

TPM

  • 1 TPM Header

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